Author:Hwang, Jennie S


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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

By: Hwang, Jennie S.

Price: $43.00

Publisher: NY, Van Nostrand Reinhold: 1981

Edition: 1st Printing

Seller ID: SB771

ISBN: 0442207549

Condition: Very Good

Textblock and binding is clean and tight. Unclipped dust jacket with light loss to extremities, some creases. 456p., including index. View more info