Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

By: Hwang, Jennie S.

Price: $43.00

Quantity: 1 available

Book Condition: Very Good


Textblock and binding is clean and tight. Unclipped dust jacket with light loss to extremities, some creases. 456p., including index.

Title: Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Author Name: Hwang, Jennie S.

Illustrator: Photographs/Graphs/Charts/Folded Maps/Rear Pocket Map

Categories: Electronics,

Edition: 1st Printing

Publisher: NY, Van Nostrand Reinhold: 1981

ISBN Number: 0442207549

ISBN Number 13: 9780442207540

Binding: Cloth

Book Condition: Very Good

Jacket Condition: Very Good (in mylar)

Type: Hardcover

Size: 8vo - over 7¾" - 9¾" tall

Seller ID: SB771

Keywords: Printed Circuits, Printed Circuits Design, Printed Circuits Construction, Solder Pastes, Electronic Surface Mount Technology, Electronic Assembly and Fabrication