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Author Name:    Hwang, Jennie S.

Title:   Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Binding:   Cloth

Book Condition:   Very Good

Jacket Condition:   Very Good (in mylar)

Type:   Hardcover

Edition:   1st Printing

Size:   8vo - over 7" - 9" tall

Publisher:   NY Van Nostrand Reinhold 1981

ISBN Number:   0442207549 / 9780442207540

Illustrator:   Photographs/Graphs/Charts/Folded Maps/Rear Pocket Map

Seller ID:   SB771

Textblock and binding is clean and tight. Unclipped dust jacket with light loss to extremities, some creases. 456p., including index.

Printed Circuits, Printed Circuits Design, Printed Circuits Construction, Solder Pastes, Electronic Surface Mount Technology, Electronic Assembly and Fabrication

Price = 43.00 USD
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